Huiqin Ling
About
Huiqin Ling has authored 54 papers that have received a total of 850 indexed citations.
This includes 39 papers in Electrical and Electronic Engineering, 25 papers in Materials Chemistry and 15 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Ferroelectric and Piezoelectric Materials (17 papers). Huiqin Ling is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (17 papers) and Ferroelectric and Piezoelectric Materials (17 papers) and collaborates with scholars based in China, United States and South Korea. Huiqin Ling's co-authors include Aidong Li, Anmin Hu, Nai‐Ben Ming, Di Wu and Tao Hang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Electrochimica Acta
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