Huizhen Huang
About
Huizhen Huang has authored 30 papers that have received a total of 296 indexed citations.
This includes 13 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 6 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloy Microstructure Properties (6 papers) and 3D IC and TSV technologies (4 papers). Huizhen Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloy Microstructure Properties (6 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China and Taiwan. Huizhen Huang's co-authors include Xiuqin Wei, Lang Zhou, Peng Xu and Hongye Huang and has published in prestigious journals such as Journal of Colloid and Interface Science, AJP Gastrointestinal and Liver Physiology and Journal of Organometallic Chemistry
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