Hyun Park
About
Hyun Park has authored 38 papers that have received a total of 452 indexed citations.
This includes 18 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 10 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Copper Interconnects and Reliability (9 papers), Electronic Packaging and Soldering Technologies (7 papers) and Metallurgy and Material Forming (5 papers). Hyun Park is often cited by papers focused on Copper Interconnects and Reliability (9 papers), Electronic Packaging and Soldering Technologies (7 papers) and Metallurgy and Material Forming (5 papers) and collaborates with scholars based in South Korea, Pakistan and United States. Hyun Park's co-authors include Young‐Chang Joo, Jongman Lee, Woojin Lee, Seungyoung Ahn and Dongwook Kim and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Acta Materialia
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Dragoslav Marinković are published in Top journals papers by Yuji Hiraoka are published in Top fields papers by Sean M. Bryant are about Top journals papers by Zongyang Li are published in Top journals papers by Yingying Cheng are published in Top journals papers by Fabio Beatrice are published in Top journals papers by Taesung Park are published in Top journals papers by Ryo Murakami are published in