Young‐Chang Joo

218 papers and 5.2k indexed citations i.

Young‐Chang Joo has authored 218 papers that have received a total of 5.2k indexed citations. This includes 158 papers in Electrical and Electronic Engineering, 85 papers in Electronic, Optical and Magnetic Materials and 70 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (70 papers), Electronic Packaging and Soldering Technologies (65 papers) and Semiconductor materials and devices (45 papers). Young‐Chang Joo is often cited by papers focused on Copper Interconnects and Reliability (70 papers), Electronic Packaging and Soldering Technologies (65 papers) and Semiconductor materials and devices (45 papers) and collaborates with scholars based in South Korea, United States and Germany. Young‐Chang Joo's co-authors include Dae‐Hyun Nam, Young-Bae Park, Byoung‐Joon Kim, In‐Suk Choi and Tae‐Youl Yang and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Physical Review Letters and Journal of the American Chemical Society