Young-Bae Park
About
Young-Bae Park has authored 145 papers that have received a total of 1.8k indexed citations.
This includes 133 papers in Electrical and Electronic Engineering, 45 papers in Electronic, Optical and Magnetic Materials and 29 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (84 papers), 3D IC and TSV technologies (55 papers) and Copper Interconnects and Reliability (45 papers). Young-Bae Park is often cited by papers focused on Electronic Packaging and Soldering Technologies (84 papers), 3D IC and TSV technologies (55 papers) and Copper Interconnects and Reliability (45 papers) and collaborates with scholars based in South Korea, United States and Singapore. Young-Bae Park's co-authors include Young‐Chang Joo, Shi‐Woo Rhee, Harry A. Atwater, Byoung‐Joon Kim and Sung Cheol Park and has published in prestigious journals such as Advanced Materials, ACS Nano and Applied Physics Letters
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