Ivy Qin
About
Ivy Qin has authored 16 papers that have received a total of 120 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 2 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Metal Forming Simulation Techniques (3 papers). Ivy Qin is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (13 papers) and Metal Forming Simulation Techniques (3 papers) and collaborates with scholars based in Canada and United States. Ivy Qin's co-authors include Horst Clauberg, Bob Chylak, Viola L. Acoff and M. Mayer and has published in prestigious journals such as Acta Materialia, Journal of Physics D Applied Physics and Scripta Materialia
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