J. C. Bea

24 papers and 173 indexed citations i.

J. C. Bea has authored 24 papers that have received a total of 173 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 10 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (17 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). J. C. Bea is often cited by papers focused on 3D IC and TSV technologies (17 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Japan, United States and South Korea. J. C. Bea's co-authors include Tetsu Tanaka, Takafumi Fukushima, M. Murugesan, Mitsumasa Koyanagi and Kangwook Lee and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices