M. Murugesan

52 papers and 363 indexed citations i.

M. Murugesan has authored 52 papers that have received a total of 363 indexed citations. This includes 43 papers in Electrical and Electronic Engineering, 15 papers in Biomedical Engineering and 12 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (19 papers) and Copper Interconnects and Reliability (12 papers). M. Murugesan is often cited by papers focused on 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (19 papers) and Copper Interconnects and Reliability (12 papers) and collaborates with scholars based in Japan, China and United States. M. Murugesan's co-authors include Tetsu Tanaka, Mitsumasa Koyanagi, Takafumi Fukushima, Hisashi Kino and J. C. Bea and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices