Hisashi Kino

52 papers and 221 indexed citations i.

Hisashi Kino has authored 52 papers that have received a total of 221 indexed citations. This includes 44 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 12 papers in Cellular and Molecular Neuroscience. The topics of these papers are 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Neuroscience and Neural Engineering (12 papers). Hisashi Kino is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Neuroscience and Neural Engineering (12 papers) and collaborates with scholars based in Japan, South Korea and China. Hisashi Kino's co-authors include Tetsu Tanaka, M. Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima and J. C. Bea and has published in prestigious journals such as IEEE Transactions on Electron Devices, Japanese Journal of Applied Physics and IEEE Electron Device Letters