J. C. Bravman
About
J. C. Bravman has authored 151 papers that have received a total of 4.3k indexed citations.
This includes 90 papers in Electronic, Optical and Magnetic Materials, 86 papers in Electrical and Electronic Engineering and 60 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (74 papers), Metal and Thin Film Mechanics (54 papers) and Semiconductor materials and devices (45 papers). J. C. Bravman is often cited by papers focused on Copper Interconnects and Reliability (74 papers), Metal and Thin Film Mechanics (54 papers) and Semiconductor materials and devices (45 papers) and collaborates with scholars based in United States, Australia and Germany. J. C. Bravman's co-authors include B. M. Lairson, T. Marieb, Richard P. Vinci, Nobumichi Tamura and S. K. Streiffer and has published in prestigious journals such as Science, Physical Review Letters and Applied Physics Letters
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