J. Maiz

20 papers and 663 indexed citations i.

J. Maiz has authored 20 papers that have received a total of 663 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanics of Materials. The topics of these papers are Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (11 papers) and Electronic Packaging and Soldering Technologies (8 papers). J. Maiz is often cited by papers focused on Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (11 papers) and Electronic Packaging and Soldering Technologies (8 papers) and collaborates with scholars based in United States, Spain and Switzerland. J. Maiz's co-authors include T. Scherban, William D. Nix, J. R. Patel, Nobumichi Tamura and C. Prasad and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.