J. Reschke
About
J. Reschke has authored 9 papers that have received a total of 418 indexed citations.
This includes 7 papers in Mechanics of Materials, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Electrical and Electronic Engineering. The topics of these papers are Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (5 papers) and Diamond and Carbon-based Materials Research (2 papers). J. Reschke is often cited by papers focused on Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (5 papers) and Diamond and Carbon-based Materials Research (2 papers) and collaborates with scholars based in Germany. J. Reschke's co-authors include S. Schiller, K. Goedicke, G. Beister, K. Steinfelder and J. Strümpfel and has published in prestigious journals such as Thin Solid Films, Surface and Coatings Technology and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
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