Jae-Woong Nah

24 papers and 686 indexed citations i.

Jae-Woong Nah has authored 24 papers that have received a total of 686 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Copper Interconnects and Reliability (8 papers). Jae-Woong Nah is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Copper Interconnects and Reliability (8 papers) and collaborates with scholars based in United States, South Korea and Japan. Jae-Woong Nah's co-authors include K. N. Tu, Jong-ook Suh, Kyung‐Wook Paik, Sebastian Engelmann and Yoichi Taira and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Journal of Applied Physics