Jang‐Hi Im
About
Jang‐Hi Im has authored 11 papers that have received a total of 305 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 4 papers in Mechanics of Materials and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Adhesion, Friction, and Surface Interactions (3 papers). Jang‐Hi Im is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (6 papers) and Adhesion, Friction, and Surface Interactions (3 papers) and collaborates with scholars based in United States and India. Jang‐Hi Im's co-authors include Paul S. Ho, Tengfei Jiang, Rui Huang, David D. Hawn and Edward O. Shaffer and has published in prestigious journals such as Journal of Applied Physics, Journal of Polymer Science Part A Polymer Chemistry and Macromolecular Symposia
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