Jason D. Reed
About
Jason D. Reed has authored 20 papers that have received a total of 391 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 9 papers in Atomic and Molecular Physics, and Optics and 4 papers in Biomedical Engineering. The topics of these papers are Semiconductor Quantum Structures and Devices (7 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (5 papers). Jason D. Reed is often cited by papers focused on Semiconductor Quantum Structures and Devices (7 papers), 3D IC and TSV technologies (6 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, Germany and United Kingdom. Jason D. Reed's co-authors include D. Temple, Chris Gregory, W. J. Schaff, Alan Huffman and Matthew Lueck and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and The British Journal of Psychiatry
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