Jee‐Hwan Bae
About
Jee‐Hwan Bae has authored 41 papers that have received a total of 558 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 17 papers in Materials Chemistry and 12 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and interfaces (10 papers) and 3D IC and TSV technologies (8 papers). Jee‐Hwan Bae is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and interfaces (10 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in South Korea, United States and India. Jee‐Hwan Bae's co-authors include Cheol‐Woong Yang, Dong Won Chun, Seung‐Boo Jung, Jeong‐Won Yoon and Kyung‐Wan Nam and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and Acta Materialia
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Peter L. Zhou are published in Top fields papers by Leonard Shengold are about Top authors papers by M. Monge-Palacios are co-authored with Top authors papers by Kürşat Oğuz Yaykaşlı are co-authored with Top journals papers by E. Sfakiotakis are published in Top journals papers by Sindhu Ramesh are published in Top authors papers by Noorbasha N. Meeravali are co-authored with Top authors papers by Jen-Chung Lou are co-authored with