Jee‐Hwan Bae

41 papers and 558 indexed citations i.

Jee‐Hwan Bae has authored 41 papers that have received a total of 558 indexed citations. This includes 25 papers in Electrical and Electronic Engineering, 17 papers in Materials Chemistry and 12 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and interfaces (10 papers) and 3D IC and TSV technologies (8 papers). Jee‐Hwan Bae is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), Semiconductor materials and interfaces (10 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in South Korea, United States and India. Jee‐Hwan Bae's co-authors include Cheol‐Woong Yang, Dong Won Chun, Seung‐Boo Jung, Jeong‐Won Yoon and Kyung‐Wan Nam and has published in prestigious journals such as Advanced Materials, Advanced Functional Materials and Acta Materialia