Jennie S. Hwang

7 papers and 243 indexed citations i.

Jennie S. Hwang has authored 7 papers that have received a total of 243 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Mechanical Engineering and 1 paper in Social Psychology. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Metal Forming Simulation Techniques (1 paper). Jennie S. Hwang is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Metal Forming Simulation Techniques (1 paper) and collaborates with scholars based in United States. Jennie S. Hwang's co-authors include Sung Yi, Thomas Hugh Feeley, George A. Barnett, E. Suhir and Anthony J. Rafanelli and has published in prestigious journals such as Journal of Applied Communication Research, Journal of Electronic Packaging and Soldering and Surface Mount Technology