Jenn‐Ming Song

126 papers and 1.9k indexed citations i.

Jenn‐Ming Song has authored 126 papers that have received a total of 1.9k indexed citations. This includes 81 papers in Electrical and Electronic Engineering, 57 papers in Mechanical Engineering and 52 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (19 papers). Jenn‐Ming Song is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), 3D IC and TSV technologies (21 papers) and Aluminum Alloys Composites Properties (19 papers) and collaborates with scholars based in Taiwan, Japan and France. Jenn‐Ming Song's co-authors include In‐Gann Chen, Ying-Ta Chiu, T. S. Lui, Yi‐Shao Lai and Truan‐Sheng Lui and has published in prestigious journals such as Nano Letters, Applied Physics Letters and Chemical Communications