Ying-Ta Chiu

22 papers and 347 indexed citations i.

Ying-Ta Chiu has authored 22 papers that have received a total of 347 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (7 papers). Ying-Ta Chiu is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (11 papers) and Copper Interconnects and Reliability (7 papers) and collaborates with scholars based in Taiwan, United States and Australia. Ying-Ta Chiu's co-authors include Yi‐Shao Lai, Jenn‐Ming Song, Kwang‐Lung Lin, Kuo‐Chang Lu and Ping‐Feng Yang and has published in prestigious journals such as Materials Science and Engineering A, Scripta Materialia and Japanese Journal of Applied Physics