Jeong‐Won Yoon

167 papers and 3.1k indexed citations i.

Jeong‐Won Yoon has authored 167 papers that have received a total of 3.1k indexed citations. This includes 166 papers in Electrical and Electronic Engineering, 116 papers in Mechanical Engineering and 11 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are Electronic Packaging and Soldering Technologies (163 papers), 3D IC and TSV technologies (130 papers) and Advanced Welding Techniques Analysis (66 papers). Jeong‐Won Yoon is often cited by papers focused on Electronic Packaging and Soldering Technologies (163 papers), 3D IC and TSV technologies (130 papers) and Advanced Welding Techniques Analysis (66 papers) and collaborates with scholars based in South Korea, Australia and United States. Jeong‐Won Yoon's co-authors include Seung‐Boo Jung, Bo‐In Noh, Ja‐Myeong Koo, Hoo-Jeong Lee and Cheol‐Woong Yang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Journal of Alloys and Compounds