Jerome A. Rejent
About
Jerome A. Rejent has authored 29 papers that have received a total of 683 indexed citations.
This includes 27 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 12 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloy Microstructure Properties (12 papers) and Intermetallics and Advanced Alloy Properties (8 papers). Jerome A. Rejent is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), Aluminum Alloy Microstructure Properties (12 papers) and Intermetallics and Advanced Alloy Properties (8 papers) and collaborates with scholars based in United States. Jerome A. Rejent's co-authors include Paul T. Vianco, Alice C. Kilgo, Paul F. Hlava, Gary L. Zender and F.M. Hosking and has published in prestigious journals such as Journal of Materials Science, Review of Scientific Instruments and Journal of materials research/Pratt's guide to venture capital sources
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Inamullah Khan are co-authored with Top countries impacted by papers by Albert P. Wong Top fields papers by Myeongjin Choi are about Top fields papers by Robert J. Paproski are about Top journals papers by Hye Jin Chang are published in Top authors papers by Maria S. Wong are co-authored with Top countries impacted by papers by Piotr Kruszewski Top fields papers by Filipe Sousa are about