Paul F. Hlava
About
Paul F. Hlava has authored 40 papers that have received a total of 2.2k indexed citations.
This includes 14 papers in Mechanical Engineering, 12 papers in Electrical and Electronic Engineering and 10 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Geological and Geochemical Analysis (9 papers) and Aluminum Alloy Microstructure Properties (6 papers). Paul F. Hlava is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Geological and Geochemical Analysis (9 papers) and Aluminum Alloy Microstructure Properties (6 papers) and collaborates with scholars based in United States, Spain and Germany. Paul F. Hlava's co-authors include M. Prinz, Paul T. Vianco, Jerome A. Rejent, B. Morosin and J. F. Kwak and has published in prestigious journals such as Journal of Applied Physics, Geochimica et Cosmochimica Acta and Journal of The Electrochemical Society
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