Jiahui Li
About
Jiahui Li has authored 19 papers that have received a total of 319 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and High-Temperature Coating Behaviors (3 papers). Jiahui Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (9 papers) and High-Temperature Coating Behaviors (3 papers) and collaborates with scholars based in Japan, China and Taiwan. Jiahui Li's co-authors include Hiroshi Nishikawa, Yu-An Shen, Siliang He, Chun-Ming Lin and Shiqi Zhou and has published in prestigious journals such as Scientific Reports, Construction and Building Materials and International Journal of Hydrogen Energy
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