Jianbiao Pan
About
Jianbiao Pan has authored 24 papers that have received a total of 265 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 4 papers in Management Science and Operations Research. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Jianbiao Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (11 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers) and collaborates with scholars based in United States, Taiwan and Germany. Jianbiao Pan's co-authors include Jeh‐Nan Pan, Dongkai Shangguan, David Geiger, Javad Mehrmashhadi and Robert H. Storer and has published in prestigious journals such as International Journal of Production Research, Journal of Electronic Materials and Microelectronics Reliability
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