Jianhao Wang
About
Jianhao Wang has authored 41 papers that have received a total of 462 indexed citations.
This includes 28 papers in Mechanical Engineering, 25 papers in Electrical and Electronic Engineering and 5 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloys Composites Properties (7 papers). Jianhao Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloys Composites Properties (7 papers) and collaborates with scholars based in China, Japan and Singapore. Jianhao Wang's co-authors include Songbai Xue, Hiroshi Nishikawa, Qiang Wang and Guojian Li and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and IEEE Access
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