Jiguang Han

26 papers and 411 indexed citations i.

Jiguang Han has authored 26 papers that have received a total of 411 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 5 papers in Statistical and Nonlinear Physics. The topics of these papers are Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloys Composites Properties (6 papers). Jiguang Han is often cited by papers focused on Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloys Composites Properties (6 papers) and collaborates with scholars based in China and United States. Jiguang Han's co-authors include Yonghuan Guo, Chengwen He and Lei Sun and has published in prestigious journals such as ACS Applied Materials & Interfaces, Small and Materials Science and Engineering A