Yonghuan Guo

54 papers and 710 indexed citations i.

Yonghuan Guo has authored 54 papers that have received a total of 710 indexed citations. This includes 49 papers in Mechanical Engineering, 31 papers in Electrical and Electronic Engineering and 8 papers in Industrial and Manufacturing Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (16 papers). Yonghuan Guo is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (19 papers) and Aluminum Alloys Composites Properties (16 papers) and collaborates with scholars based in China, United States and Taiwan. Yonghuan Guo's co-authors include Chengwen He, Jiguang Han and Lei Sun and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and Solar Energy Materials and Solar Cells