Jihye Kim

35 papers and 375 indexed citations i.

Jihye Kim has authored 35 papers that have received a total of 375 indexed citations. This includes 15 papers in Biomedical Engineering, 12 papers in Radiology, Nuclear Medicine and Imaging and 8 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Monoclonal and Polyclonal Antibodies Research (6 papers) and 3D IC and TSV technologies (5 papers). Jihye Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Monoclonal and Polyclonal Antibodies Research (6 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in South Korea, United States and Germany. Jihye Kim's co-authors include Taek‐Soo Kim, Wonhee Lee, Kyung‐Wook Paik, Tae‐Ik Lee and Sung Gap Im and has published in prestigious journals such as PLoS ONE, Biochemical and Biophysical Research Communications and ACS Applied Materials & Interfaces