Jing‐Cheng Lin
About
Jing‐Cheng Lin has authored 17 papers that have received a total of 323 indexed citations.
This includes 12 papers in Electronic, Optical and Magnetic Materials, 11 papers in Mechanics of Materials and 10 papers in Electrical and Electronic Engineering. The topics of these papers are Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers). Jing‐Cheng Lin is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in Taiwan and United States. Jing‐Cheng Lin's co-authors include Chiapyng Lee, Chenglin Huang, Yu‐Lin Kuo, Chih‐Huang Lai and Mong-Song Liang and has published in prestigious journals such as Journal of The Electrochemical Society, Applied Surface Science and Journal of Physics D Applied Physics.
In The Last Decade
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