Jing‐Cheng Lin

17 papers and 326 indexed citations i.

About

Jing‐Cheng Lin has authored 17 papers that have received a total of 326 indexed citations. This includes 12 papers in Electronic, Optical and Magnetic Materials, 11 papers in Mechanics of Materials and 10 papers in Electrical and Electronic Engineering. The topics of these papers are Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers). Jing‐Cheng Lin is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Metal and Thin Film Mechanics (11 papers) and Semiconductor materials and devices (8 papers) and collaborates with scholars based in Taiwan and United States. Jing‐Cheng Lin's co-authors include Chiapyng Lee, Chih‐Huang Lai, Yu‐Lin Kuo, Chenglin Huang and Mong-Song Liang and has published in prestigious journals such as Journal of The Electrochemical Society, Applied Surface Science and Journal of Physics D Applied Physics.

In The Last Decade

Fields of papers published by Jing‐Cheng Lin

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Jing‐Cheng Lin

Since Specialization
Citations
Rankless by CCL
2025