Jing-en Luan

9 papers and 85 indexed citations i.

Jing-en Luan has authored 9 papers that have received a total of 85 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 4 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Injection Molding Process and Properties (2 papers). Jing-en Luan is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Injection Molding Process and Properties (2 papers) and collaborates with scholars based in Singapore, Switzerland and Italy. Jing-en Luan's co-authors include Guojun Hu, Xavier Baraton, Chwee Teck Lim, Bin Gu and Z.W. Zhong and has published in prestigious journals such as NDT & E International, Microelectronics Reliability and Journal of Electronic Packaging