Jong‐Kai Lin
About
Jong‐Kai Lin has authored 15 papers that have received a total of 160 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (12 papers) and Aluminum Alloys Composites Properties (2 papers). Jong‐Kai Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (12 papers) and Aluminum Alloys Composites Properties (2 papers) and collaborates with scholars based in United States and Singapore. Jong‐Kai Lin's co-authors include Jin‐Wook Jang, D. R. Frear, Fa Xing, Xiaowu Zhang and Seng‐Tiong Ho and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Microelectronics Reliability
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