Jong‐Min Kim
About
Jong‐Min Kim has authored 108 papers that have received a total of 1.0k indexed citations.
This includes 65 papers in Electrical and Electronic Engineering, 26 papers in Biomedical Engineering and 25 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (37 papers) and Minerals Flotation and Separation Techniques (10 papers). Jong‐Min Kim is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (37 papers) and Minerals Flotation and Separation Techniques (10 papers) and collaborates with scholars based in South Korea, Japan and United States. Jong‐Min Kim's co-authors include Kiyokazu Yasuda, Seong Hyuk Lee, Seung Hoon Oh, Young-Eui Shin and Masahiro Yasuda and has published in prestigious journals such as Langmuir, Journal of Power Sources and Scientific Reports
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