Kiyokazu Yasuda

54 papers and 344 indexed citations i.

Kiyokazu Yasuda has authored 54 papers that have received a total of 344 indexed citations. This includes 33 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 11 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Nanomaterials and Printing Technologies (8 papers). Kiyokazu Yasuda is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Nanomaterials and Printing Technologies (8 papers) and collaborates with scholars based in Japan, Taiwan and United States. Kiyokazu Yasuda's co-authors include Jong‐Min Kim, Masahiro Yasuda, Jenn‐Ming Song, Hideyuki Masuda and Tadashi Takemoto and has published in prestigious journals such as Food Chemistry, Journal of Applied Mechanics and Applied Surface Science