Jong-ook Suh
About
Jong-ook Suh has authored 17 papers that have received a total of 1.3k indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 4 papers in Automotive Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Intermetallics and Advanced Alloy Properties (4 papers). Jong-ook Suh is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in United States, Italy and Singapore. Jong-ook Suh's co-authors include K. N. Tu, Nobumichi Tamura, Jae-Woong Nah, R. Peter Dillon and Douglas C. Hofmann and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia
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