Jun So Pak

27 papers and 700 indexed citations i.

Jun So Pak has authored 27 papers that have received a total of 700 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 3 papers in Aerospace Engineering and 3 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (20 papers), 3D IC and TSV technologies (17 papers) and Electronic Packaging and Soldering Technologies (7 papers). Jun So Pak is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (20 papers), 3D IC and TSV technologies (17 papers) and Electronic Packaging and Soldering Technologies (7 papers) and collaborates with scholars based in South Korea, United States and Japan. Jun So Pak's co-authors include Joungho Kim, Jonghyun Cho, Kyoungchoul Koo, Joohee Kim and Kunwoo Park and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Microwave and Wireless Components Letters and IEEE Transactions on Electromagnetic Compatibility