Jonghyun Cho
About
Jonghyun Cho has authored 36 papers that have received a total of 753 indexed citations.
This includes 36 papers in Electrical and Electronic Engineering, 5 papers in Aerospace Engineering and 3 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (23 papers) and Electronic Packaging and Soldering Technologies (11 papers). Jonghyun Cho is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (23 papers) and Electronic Packaging and Soldering Technologies (11 papers) and collaborates with scholars based in United States, South Korea and Italy. Jonghyun Cho's co-authors include Joungho Kim, Jun So Pak, Joohee Kim, Kunwoo Park and Kiyeong Kim and has published in prestigious journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Instrumentation and Measurement and IEEE Transactions on Electromagnetic Compatibility
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