Kiyeong Kim
About
Kiyeong Kim has authored 16 papers that have received a total of 321 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 2 papers in Aerospace Engineering and 1 paper in Computer Networks and Communications. The topics of these papers are Electromagnetic Compatibility and Noise Suppression (13 papers), 3D IC and TSV technologies (11 papers) and Electronic Packaging and Soldering Technologies (3 papers). Kiyeong Kim is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (13 papers), 3D IC and TSV technologies (11 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in South Korea and United States. Kiyeong Kim's co-authors include Joungho Kim, Jonghyun Cho, Kunwoo Park, Jun So Pak and Heegon Kim and has published in prestigious journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology
In The Last Decade
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