K. N. Subramanian
About
K. N. Subramanian has authored 156 papers that have received a total of 4.7k indexed citations.
This includes 69 papers in Mechanical Engineering, 65 papers in Electrical and Electronic Engineering and 26 papers in Ecology. The topics of these papers are Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (31 papers) and Aluminum Alloys Composites Properties (30 papers). K. N. Subramanian is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (31 papers) and Aluminum Alloys Composites Properties (30 papers) and collaborates with scholars based in United States, China and India. K. N. Subramanian's co-authors include J. P. Lucas, Thomas R. Bieler, S. Choi, Jin Gyun Lee and Fei Guo and has published in prestigious journals such as Science, Cell and Proceedings of the National Academy of Sciences
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