Thomas R. Bieler
About
Thomas R. Bieler has authored 207 papers that have received a total of 9.3k indexed citations.
This includes 122 papers in Mechanical Engineering, 113 papers in Materials Chemistry and 71 papers in Electrical and Electronic Engineering. The topics of these papers are Microstructure and mechanical properties (72 papers), Electronic Packaging and Soldering Technologies (58 papers) and Intermetallics and Advanced Alloy Properties (38 papers). Thomas R. Bieler is often cited by papers focused on Microstructure and mechanical properties (72 papers), Electronic Packaging and Soldering Technologies (58 papers) and Intermetallics and Advanced Alloy Properties (38 papers) and collaborates with scholars based in United States, Germany and United Kingdom. Thomas R. Bieler's co-authors include M.A. Crimp, K. N. Subramanian, J. P. Lucas, Philip Eisenlohr and Tae-Kyu Lee and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B
In The Last Decade
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