Ke Pan

25 papers and 109 indexed citations i.

Ke Pan has authored 25 papers that have received a total of 109 indexed citations. This includes 12 papers in Electrical and Electronic Engineering, 6 papers in Mechanics of Materials and 5 papers in Civil and Structural Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Advanced Decision-Making Techniques (3 papers). Ke Pan is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Advanced Decision-Making Techniques (3 papers) and collaborates with scholars based in China and United States. Ke Pan's co-authors include Seungbae Park, Xiaoping Dai, Wenhui Zhu, Wenting Zhao and Chukwudi Okoro and has published in prestigious journals such as IEEE Journal of Emerging and Selected Topics in Power Electronics, Microelectronics Reliability and Geotechnical and Geological Engineering