Kenny C. Otiaba
About
Kenny C. Otiaba has authored 13 papers that have received a total of 290 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 8 papers in Materials Chemistry and 8 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Thermal properties of materials (8 papers) and 3D IC and TSV technologies (4 papers). Kenny C. Otiaba is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Thermal properties of materials (8 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United Kingdom, Ghana and Hong Kong. Kenny C. Otiaba's co-authors include Raj Bhatti, Sabuj Mallik, N.N. Ekere, Emeka H. Amalu and Michael Okereke and has published in prestigious journals such as Applied Thermal Engineering, Microelectronic Engineering and Microelectronics Reliability
In The Last Decade
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