Sabuj Mallik
About
Sabuj Mallik has authored 46 papers that have received a total of 801 indexed citations.
This includes 26 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 12 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), Rheology and Fluid Dynamics Studies (10 papers) and 3D IC and TSV technologies (9 papers). Sabuj Mallik is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), Rheology and Fluid Dynamics Studies (10 papers) and 3D IC and TSV technologies (9 papers) and collaborates with scholars based in United Kingdom, Malaysia and Ghana. Sabuj Mallik's co-authors include N.N. Ekere, Raj Bhatti, Kenny C. Otiaba, Emeka H. Amalu and R. Durairaj and has published in prestigious journals such as Composites Part B Engineering, Journal of Materials Processing Technology and Applied Thermal Engineering
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