Kimihiro Yamanaka

36 papers and 250 indexed citations i.

Kimihiro Yamanaka has authored 36 papers that have received a total of 250 indexed citations. This includes 22 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 7 papers in Social Psychology. The topics of these papers are Electronic Packaging and Soldering Technologies (21 papers), Copper Interconnects and Reliability (19 papers) and 3D IC and TSV technologies (17 papers). Kimihiro Yamanaka is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), Copper Interconnects and Reliability (19 papers) and 3D IC and TSV technologies (17 papers) and collaborates with scholars based in Japan, United States and South Korea. Kimihiro Yamanaka's co-authors include Katsuaki Suganuma, Yutaka Tsukada, Shijo Nagao, Keun‐Soo Kim and Keisuke Morishima and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Scripta Materialia