Yutaka Tsukada

41 papers and 581 indexed citations i.

Yutaka Tsukada has authored 41 papers that have received a total of 581 indexed citations. This includes 25 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (12 papers) and High Temperature Alloys and Creep (8 papers). Yutaka Tsukada is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (12 papers) and High Temperature Alloys and Creep (8 papers) and collaborates with scholars based in Japan, China and United States. Yutaka Tsukada's co-authors include Masao Sakane, Katsuaki Suganuma, Kimihiro Yamanaka, Hideo Nishimura and Keun‐Soo Kim and has published in prestigious journals such as Electrochimica Acta, Journal of Alloys and Compounds and Scripta Materialia