Kun Fang

32 papers and 546 indexed citations i.

Kun Fang has authored 32 papers that have received a total of 546 indexed citations. This includes 16 papers in Mechanical Engineering, 10 papers in Electrical and Electronic Engineering and 9 papers in Materials Chemistry. The topics of these papers are Microstructure and Mechanical Properties of Steels (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Welding Techniques and Residual Stresses (7 papers). Kun Fang is often cited by papers focused on Microstructure and Mechanical Properties of Steels (8 papers), Electronic Packaging and Soldering Technologies (8 papers) and Welding Techniques and Residual Stresses (7 papers) and collaborates with scholars based in China, United States and United Kingdom. Kun Fang's co-authors include Xuesong Liu, Jianguo Yang, Wayne Johnson, Zhibo Dong and Shilei Lu and has published in prestigious journals such as IEEE Transactions on Power Electronics, Energy and Buildings and Journal of Materials Processing Technology