Kunmo Chu

31 papers and 652 indexed citations i.

Kunmo Chu has authored 31 papers that have received a total of 652 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 11 papers in Materials Chemistry and 9 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Carbon Nanotubes in Composites (8 papers). Kunmo Chu is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (10 papers) and Carbon Nanotubes in Composites (8 papers) and collaborates with scholars based in South Korea, United States and Germany. Kunmo Chu's co-authors include Sung Hoon Park, Duk Young Jeon, Dongouk Kim, Yoonchul Sohn and Sang-Eui Lee and has published in prestigious journals such as Advanced Functional Materials, Nanoscale and Optics Letters