Kuo‐Ning Chiang
About
Kuo‐Ning Chiang has authored 143 papers that have received a total of 1.5k indexed citations.
This includes 118 papers in Electrical and Electronic Engineering, 42 papers in Mechanical Engineering and 34 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (92 papers), 3D IC and TSV technologies (62 papers) and Metal Forming Simulation Techniques (13 papers). Kuo‐Ning Chiang is often cited by papers focused on Electronic Packaging and Soldering Technologies (92 papers), 3D IC and TSV technologies (62 papers) and Metal Forming Simulation Techniques (13 papers) and collaborates with scholars based in Taiwan, United States and China. Kuo‐Ning Chiang's co-authors include Chang‐Chun Lee, Hsien‐Chie Cheng, Steven Y. Liang, S. Chiang and Robert E. Fulton and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Carbon
In The Last Decade
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