Chang‐Chun Lee
About
Chang‐Chun Lee has authored 151 papers that have received a total of 1.8k indexed citations.
This includes 104 papers in Electrical and Electronic Engineering, 45 papers in Biomedical Engineering and 27 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (57 papers), 3D IC and TSV technologies (39 papers) and Semiconductor materials and devices (34 papers). Chang‐Chun Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (57 papers), 3D IC and TSV technologies (39 papers) and Semiconductor materials and devices (34 papers) and collaborates with scholars based in Taiwan, United States and Philippines. Chang‐Chun Lee's co-authors include Kuo‐Ning Chiang, Yen Sun, Huey W. Huang, Tao‐Chih Chang and Yu-Min Lin and has published in prestigious journals such as Nano Letters, ACS Nano and Applied Physics Letters
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